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INTEGRATED CIRCUITS
DATA SHEET
TZA1045 Photodiode and amplifier IC for CD and DVD applications
Preliminary specification Supersedes data of 2002 Mar 26 2002 Nov 27
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
FEATURES * High frequency RF amplifiers (typical bandwidth = 240 MHz) * Suitable for all CD (785 nm) and DVD (655 nm) read/write applications * Four high bandwidth central outputs (A, B, C, and D), four satellite outputs (E, F, G, and H) and one high bandwidth differential output (RFP, RFN) * Internal current clamp and current fold back (power reduction) * Versatile programmable gain switches (CD/DVD, H/L, and R/W) * Single 5 V supply * Current outputs for optimum signal transport over flex cable * Small outline package SSOP16T with good positional tolerance. APPLICATIONS * CD and DVD read/write applications. GENERAL DESCRIPTION The TZA1045 is a single optical pick-up IC for read/write systems and is suitable for CD and DVD applications. ORDERING INFORMATION TYPE NUMBER TZA1045TS PACKAGE NAME SSOP16T DESCRIPTION plastic shrink small outline package/transparent; 16 leads (straight); body width 4.4 mm
TZA1045
The device contains eight RF amplifiers for the central and satellite diodes and one differential RF amplifier (RFP and RFN) which handles the sum of the four A, B, C, and D central diode signals. Programming the gain is a very versatile way to optimize interfacing between the TZA1045 and the pre-amplifier. The gain can be programmed for CD or DVD media with the gain switch CD/DVD. The H/L switch can be used for CD-R or CD-RW discs. Gain switch R/W is used to reduce the gain during writing. During writing, the high peak signals for the central and satellite segments are clamped internally and the output currents of the A, B, C, D, E, F, G, and H segments are reduced to almost zero (fold back) to minimize the power consumption. All outputs are current outputs that can supply a maximum of 8 mA. In CD-R writing mode, the clipping level of the output currents is between 5 and 8 mA. The SSOP16T package has a low spread on the Z tolerance. The Z tolerance is measured between the diodes (chip surface) and the bottom of the leads. The diodes have an offset of 54 m in the `y' direction with respect to the leadframe centre and a tolerance of 50 m in both `x' and `y' directions.
VERSION SOT734-1
2002 Nov 27
2
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
QUICK REFERENCE DATA SYMBOL Supplies VDD1 VDD2 IDD1 supply voltage front-end supply voltage back-end supply current front-end dark conditions writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW IDD2 Tamb B-3dB(cen) supply current back-end dark conditions Temperature range ambient temperature 0 - - - - - - - - - - 17.4 41.2 17.2 15.2 42.5 41.8 42.2 41.2 6.0 4.5 4.5 5.0 5.0 PARAMETER CONDITIONS MIN. TYP.
TZA1045
MAX.
UNIT
5.5 5.5 - - - - - - - - - 70
V V mA mA mA mA mA mA mA mA mA C
RF bandwidth RF bandwidth central channels A, B, C, and D Io = 1.5 mA writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW B-3dB(dif) RF bandwidth differential channels RFP and RFN Io = 1 mA writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW - - - - - - - - 171 289 360 148 191 130 188 110 - - - - - - - - MHz MHz MHz MHz MHz MHz MHz MHz - - - - - - - - 170 205 360 150 211 128 205 109 - - - - - - - - MHz MHz MHz MHz MHz MHz MHz MHz
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL B-3dB(sat) PARAMETER CONDITIONS MIN. - - - - - - - - - TYP. 171 97 360 148 111 54 97 48
TZA1045
MAX. - - - - - - - - -
UNIT MHz MHz MHz MHz MHz MHz MHz MHz
RF bandwidth satellite channels Io = 0.5 mA E, F, G and H writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW
Settling time tset(cen) settling time central segment outputs settling time satellite segment outputs CD-R write mode; 2% accuracy of read level (60 A); Io = 3 mA to 60 A; note 1 CD-R write mode; 2% accuracy of read level (15A); Io = 0.75 mA to 15 A; note 1 writing; = 655 nm Io(cen) Io(sat) Io(RFP) Io(RFN) sCD-R output current sensitivity for CD-R writing; = 785 nm Io(cen) Io(sat) Io(RFP) Io(RFN) sDVD+RW output current sensitivity for DVD+RW writing; = 655 nm Io(cen) Io(sat) Io(RFP) Io(RFN) reading; = 655 nm Io(cen) Io(sat) Io(RFP) Io(RFN) - - - - 42.8 163 48.3 44.3 - - - - A/W A/W A/W A/W - - - - 2.89 11.1 2.73 2.78 - - - - A/W A/W A/W A/W - - - - 37.5 142 2.99 3.14 - - - - A/W A/W A/W A/W - - - - 1.47 5.63 1.36 1.39 - - - - A/W A/W A/W A/W 15 ns
tset(sat)
-
30
-
ns
Sensitivity sDVD+R output current sensitivity for DVD+R
2002 Nov 27
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL sCD-RW PARAMETER output current sensitivity for CD-RW Io(cen) Io(sat) Io(RFP), Io(RFN) Io(RFP), Io(RFN) reading; = 785 nm Io(cen) Io(sat) Io(RFP), Io(RFN) Io(RFP), Io(RFN) sDVD-ROM output current sensitivity for DVD-ROM reading; = 655 nm Io(cen) Io(sat) Io(RFP) Io(RFN) sCD-ROM output current sensitivity for CD-ROM reading; = 785 nm Io(cen) Io(sat) Io(RFP) Io(RFN) Note 1. The settling time includes the recovery time. - - - - 74.8 289 80.0 82.0 - - - - 21.6 83.6 21.0 21.0 - - - - 151 590 164 168 CONDITIONS writing; = 785 nm - - - - 5.35 20.4 5.05 5.13 MIN. TYP.
TZA1045
MAX. - - - - - - - - - - - - - - - -
UNIT A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
BLOCK DIAGRAM
TZA1045
handbook, full pagewidth
GND VDD2 VDD1
6 3 A 14
VDD1
VDD2 1 A
VDD1 B
VDD2 7 B
VDD1 C
VDD2 8 C
VDD1 D
VDD2 2 D
VDD1 E
VDD2 16 E
VDD1 F
VDD1
VDD2 10 F
VDD1 G
VDD2 15 G
VDD1 H
VDD2 9 H
VDD2 4 H/L CD/DVD R/W 12 13 11 5 RFN CODER(1) RFP
TZA1045
VDD2
MGU615
(1) The coder translates the three digital inputs into the appropriate gain level of each amplifier. The limiter is switched on only for CD-R writing for the segment outputs.
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
PINNING SYMBOL A D VDD2 RFP RFN GND B C H F R/W H/L CD/DVD VDD1 G E PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION central segment output A central segment output D supply voltage back-end positive RF output negative RF output ground central segment output B central segment output C satellite segment output H satellite segment output F gain select switch for reading or writing gain select switch for high or low reflective media gain select switch for CD or DVD supply voltage front-end satellite segment output G satellite segment output E Fig.2 Pin configuration.
D VDD2 RFP RFN GND B C 2 3 4 15 G
handbook, halfpage
TZA1045
A
1
16 E
14 VDD1 13 CD/DVD
TZA1045TS
5 6 7 8
MGU614
12 H/L 11 R/W 10 F 9 H
MODE SELECTION Table 1 Coder switching PIN LEVEL MODE R/W LOW LOW LOW LOW HIGH HIGH HIGH HIGH H/L LOW LOW HIGH HIGH LOW LOW HIGH HIGH CD/DVD LOW HIGH LOW HIGH LOW HIGH LOW HIGH DVD+R; writing CD-R; writing DVD+RW; writing CD-RW; writing DVD-ROM; reading CD-ROM; reading DVD+RW; reading CD-RW; reading
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
MECHANICAL DATA
TZA1045
handbook, full pagewidth
115
50
50
115
E 145
F
A
B
G
H 100
D
C
150
150
MGU616
Dimensions in m. Space between central segments: <1 m. Space between satellite segments: <1 m.
Fig.3 Photodiode configuration.
handbook, full pagewidth
16
15
14
E
13
12
11
10
9
y x
45 see detail X
+ 54 m offset package centre
1
2
3
4
5
6
7
8
MGU617
DETAIL X
45 angle is with respect to the leadframe. Drawing is not to scale. Package window is not shown.
Fig.4 Diagram showing position of the photodiode array with respect to the package (top view).
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD1 VDD2 VDD1 VDD2 Vn supply voltage front-end supply voltage back-end supply voltage difference with respect to VDD2 supply voltage difference with respect to VDD1 voltage at pins A, B, C, D, E, F, G, H, RFP and RFN CD/DVD, H/L and R/W -0.3 -0.3 PARAMETER MIN. -0.3 -0.3
TZA1045
MAX. +5.5 +5.5
UNIT V V
VDD2 - 0.3 VDD2 + 0.3 V VDD1 - 0.3 VDD1 + 0.3 V VDD2 + 0.3 V VDD1 + 0.3 V
CHARACTERISTICS VDD1 = VDD2 = 5 V; pin R/W = LOW; pin H/L = LOW; pin CD/DVD = HIGH; VA to VH = 2.5 V; VRFP = VRFN = 2.5 V; measured in dark conditions; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VDD1 VDD2 IDD1 supply voltage front-end supply voltage back-end supply current front-end note 1 note 1 dark conditions; note 2 writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW IDD2 supply current back-end dark conditions; Tamb = 0 to 70 C; note 2 12.8 30.9 12.9 11.4 31.9 31.3 31.7 30.9 4.5 17.4 41.2 17.2 15.2 42.5 41.8 42.2 41.2 6.0 21.3 51.5 21.5 19.0 53.1 52.2 52.8 51.5 7.5 mA mA mA mA mA mA mA mA mA 4.5 4.5 5.0 5.0 5.5 5.5 V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Temperature range Tamb B-3dB ambient temperature 0 - 70 C
Central segment outputs; pins A, B, C, and D channel A, B, C, and D RF bandwidth Io = 1.5 mA writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW 140 170 300 125 195 110 170 90 170 205 360 150 211 128 205 109 200 235 420 175 245 150 235 130 MHz MHz MHz MHz MHz MHz MHz MHz
2002 Nov 27
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL tset PARAMETER settling time CONDITIONS CD-R write mode; Io = 3 mA to 60 A; 2% accuracy of read level (60 A); note 3 Io = 1.5 mA; fo = 13 to 130 MHz reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW Msens Vo Io Io(offset) Io(clip) In(o) channel A, B, C and D matching sensitivity output voltage range output current output offset current output current clipping level dark conditions; Tamb = 0 to 70 C CD-R writing; note 5 note 4 - - - - -5 1 0 -15 5 0.5 0.75 0.5 0.9 - - 3 - - - - - - +5 - MIN. 15 TYP. -
TZA1045
MAX.
UNIT ns
td(g)
group delay variation
ns ns ns ns % V mA A mA
VDD2 - 1 8 +7 8
spot noise output current Io = 2.0 mA; fo = 50 MHz reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW - - - - 480 1660 685 2500 - - - - pA/Hz pA/Hz pA/Hz pA/Hz
Differential RF outputs; pins RFP and RFN B-3dB channel RFP and RFN RF bandwidth Io = 1 mA writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW tset settling time CD-R write mode; Io = 2 mA to 40 A; 2% accuracy of read level (40 A); note 3 Io = 1 mA; fi = 13 to 130 MHz reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW - - - - 0.5 0.75 0.5 0.9 - - - - ns ns ns ns 140 240 300 125 160 110 160 90 - 171 289 360 148 191 130 188 110 15 200 340 420 175 220 150 220 130 - MHz MHz MHz MHz MHz MHz MHz MHz ns
td(g)
group delay variation
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL CMR Vo Io Io(offset) PARAMETER common mode ripple output voltage range output current output offset current dark conditions; Tamb = 0 to 70 C pin RFP pin RFN In(o) spot noise differential output current Io = 3 mA; fo = 50 MHz reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW Satellite segment outputs; pins E, F, G and H B-3dB channel E, F, G and H RF bandwidth Io = 0.5 mA writing DVD+R writing CD-R writing DVD+RW writing CD-RW reading DVD-ROM reading CD-ROM reading DVD+RW reading CD-RW tset settling time CD-R write mode; Io = 0.75 mA to 15 A; 2% accuracy of read level (15 A); note 3 note 7 140 80 300 125 90 45 80 40 - 171 97 360 148 111 54 97 48 30 200 115 420 175 130 65 115 55 - - - - - 360 1250 515 1850 - - - - -13 +14 - - 0 0 CONDITIONS Io = 2 mA (peak); up to 130 MHz; note 6 - 1 0 MIN. TYP. -30 - 2 -
TZA1045
MAX.
UNIT dB V mA
VDD2 - 1 8
A A pA/Hz pA/Hz pA/Hz pA/Hz
MHz MHz MHz MHz MHz MHz MHz MHz ns
Msens Vo Io Io(offset) Io(clip) Zi(pd) VIL VIH tt(G)
channel E, F, G and H matching sensitivity output voltage range output current output offset current current clipping level
-5 1 0
- - 0.75 - - 230 - - 2
+5 VDD2 - 1 8 +25 8 - +1 -
% V mA A mA
dark conditions; Tamb = 0 to 70 C CD-R writing; note 5
-31 5 - -0.2 2.1 -
Control inputs; pins R/W, H/L and CD/DVD pull-down input impedance LOW-level input voltage HIGH-level input voltage gain transition time k V s
VDD2 + 0.2 V
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL PARAMETER CONDITIONS writing; = 655 nm; note 9 Io(cen) Io(sat) Io(RFP) Io(RFN) sCD-R output current sensitivity for CD-R writing; = 785 nm; note 10 Io(cen) Io(sat) Io(RFP) Io(RFN) sDVD+RW output current sensitivity for DVD+RW writing; = 655 nm; note 9 Io(cen) Io(sat) Io(RFP) Io(RFN) reading; = 655 nm; note 11 Io(cen) Io(sat) Io(RFP) Io(RFN) sCD-RW output current sensitivity for CD-RW writing; = 785 nm; note 9 Io(cen) Io(sat) Io(RFP), Io(RFN) Io(RFP), Io(RFN) reading; = 785 nm; note 11 Io(cen) Io(sat) Io(RFP), Io(RFN) Io(RFP), Io(RFN) sDVD-ROM output current sensitivity for DVD-ROM reading; = 655 nm; note 11 Io(cen) Io(sat) Io(RFP) Io(RFN) - - - - 21.6 83.6 21.0 21.0 - - - - - - - - 151 590 164 168 - - - - - - - - 5.35 20.4 5.05 5.13 - - - - - - - - 42.8 163 48.3 44.3 - - - - - - - - 2.89 11.1 2.73 2.78 - - - - - - - - 37.5 142 2.99 3.14 - - - - - - - - 1.47 5.63 1.36 1.39 - - - - MIN. TYP.
TZA1045
MAX.
UNIT
Sensitivity; note 8 sDVD+R output current sensitivity for DVD+R A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W A/W
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL sCD-ROM PARAMETER output current sensitivity for CD-ROM Io(cen) Io(sat) Io(RFP) Io(RFN) Notes CONDITIONS reading; = 785 nm; note 11 - - - - 74.8 289 80.0 82.02 - - - - MIN. TYP.
TZA1045
MAX.
UNIT A/W A/W A/W A/W
1. The supplies are connected internally by diodes. Differences between the supply voltages should not exceed 0.3 V. 2. Estimated average power consumption (typical value): P = VDD x (1.4 x Io(AV) x 9 + IDD1 + IDD2) where Io(AV) is the average output current. Conditions: VDD = VDD1 = VDD2 and Io < 8 mA. 3. The settling time includes the recovery time. I o(max) - I o(min) 4. Outputs A, B, C, and D: Io = 3 mA output current. Definition of matching: ----------------------------------------------------1 ( I A + I B + I C + I D ) x -4 5. The clipping function is active in the CD-R write mode for the segment outputs (not for outputs RFP and RFN) and in the read mode for all outputs. In the read mode, the clipping level is increased to 8 mA. I RFP + I RFN 6. Definition: 20log x ----------------------------I RFP - I RFN I o(max) - I o(min) 7. Outputs E, F, G, and H outputs: Io = 1.5 mA output current. Definition of matching: ----------------------------------------------------1 ( I E + I F + I G + I H ) x -4 8. The sensitivity of the TZA1045 is specified in A/W because it has current outputs. In the application diagram (see Fig.5) the resistors of 150 convert the currents into voltages (V/W). The maximum absolute spread is 10%. 9. Writing without clipping. 10. Writing with clipping in CD-R mode for all segment outputs (not outputs RFP and RFN). 11. Reading with clipping active and switched to a level of typ. 8 mA.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
APPLICATION INFORMATION
TZA1045
An application example for the TZA1045 is shown in Fig.5. The satellite segment pins are cross-coupled to be suitable for rewritable applications.
handbook, full pagewidth
VDD
150 E G 16
150 CD/DVD H/L R/W
150
150 H F
15
14
13
12
11
10
9
TZA1045
1 D A 150 Vref1 Vref2
MGU618
2
3
4
5
6
7
8 B C
150
75
75
150
150
RFP
RFN
Fig.5 Application example.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
PACKAGE OUTLINE
TZA1045
SSOP16T: plastic shrink small outline package/transparent; 16 leads (straight); body width 4.4 mm SOT734-1
D E Dw c y A X
pin 1 index
HE
vM A
Z
16
9
A6 A2 A7
pin 1 index detail X
L
1
bp e
8
wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A2 1.3 1.1 A6 0.37 0.17 A7 0.25 0.15 bp 0.32 0.20 c 0.25 0.13 D(1) 5.3 5.1 Dw(2) 2.1 1.9 E(1) 4.5 4.3 e 0.65 HE 6.7 6.5 L 1.1 v 0.2 w 0.13 y 0.1 Z(1) 0.48 0.18
Notes 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. 2. Sensor area OUTLINE VERSION SOT734-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 01-11-09
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TZA1045
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3)
TZA1045
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TZA1045
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
NOTES
TZA1045
2002 Nov 27
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp20
Date of release: 2002
Nov 27
Document order number:
9397 750 10088

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